Copper Plating-Magnetron Sputtering Vacuum Coating Equipments

Copper Plating-Magnetron Sputtering Vacuum Coating Equipments

Nowadays, PVD Vacuum Coating Equipments is more and more used in the metal plating field. such as copper plating and steel plating field.
In the electroless plating, electroless copper plating is very important. With the development of the electronics industry, in particular the demand for rapid development of computer, electronic communication equipment, and household appliances, double-sided and multi-layer printed circuit board is great.
The PCB hole metal from the complex requirements of electrical conductivity, weldability, coating toughness and economy, the non-copper perfectly. Further other non-metallic materials (such as plastic, ceramic, etc.), electroless copper plating applications also very wide. In the future, the aspect of non-metallic materials, metal, copper plating the amount of about 90%. Currently, the LSI chip production, instead of aluminum interconnects using electroless copper wiring width of less than 90nm.
Electroless copper plating solution from stability can be divided into low and high stability of electroless copper electroless copper stability; from the deposition rate to points, can be divided into low speed and high speed copper plating rate. The former deposition rate is generally 2μm / h ~ 4μm / h; the latter is generally 10μm / h.
High speed copper plating is generally used for semi-additive method or full-additive method directly thick steel plating, has been the rapid development of high temperature and low-temperature high-speed craft.
In recent years there has been differential copper plating method, namely through the pore walls of the PCB copper layer thickness is about the complex chemistry of the copper layer on the copper layer thickness finished school three times to 5 times, not only reduces the metallic copper consumption, but also reduce the cost, called the fourth milestone in the history of copper plating.
Electroless copper plating solution generally consists of copper, complexing agents, reducing and stabilizing agent.