Vacuum evaporation coating machine and the magnetron sputtering plating aluminum function

Vacuum evaporation coating machine and the magnetron sputtering plating aluminum function

Vacuum evaporation coating machine and magnetron sputtering plating aluminum function, electron beam evaporation vacuum coating machine and magnetron sputtering plating aluminum function analysis research, in order to obtain features outstanding semiconductor electrode Al film, we optimized technical parameters, the preparation of a series of superior function of Al thin films. Through theoretical calculation and function test, analysis compared the vacuum coating equipment, electron beam evaporation and magnetron sputtering characteristic of two kinds of method preparation of Al film.
Strict control of Al film thickness is very important, because the thickness of Al film will directly influence the other functions of the Al film, and then influence the reliability of semiconductor devices. About the high back pressure power tube, its high working voltage, current, not necessarily the thickness of the metal film will form into Al membrane current density per unit area is too high, easy to burn. On semiconductor equipment normally, Al thin layer, the continuity of the membrane is poorer, island shaped or mesh structure, lead to pressure welding lead hard, not easy pressure welding or bonding not firm, and then affect the rate of finished product; Al layer too thick, resulting in lithography graphics can't see, when a difficult and prone to marginal corrosion and corrosion "article".
Selects the electron beam evaporation vacuum coating machine, planetary organization uniform rolling when packing film, the probability of each substrate in the accumulation of Al film equality; Planet group gathering in the pot steamed originate, each substrate accumulation rate under vacuum must be flat. Selection of vacuum coating machine magnetron sputtering deposition method, because of accumulation can target current and voltage control, is also sputtering power can regulate and control, so the film thickness has good controllability and repeatability, and can be made in larger appearance even thickness of film.
Reflect the Al film and substrate adhesion between each other forces, it is also an important factor to ensure equipment is durable. Vacuum coating equipment sputtering atom energy is 1 to 2 orders of magnitude higher than evaporation atomic energy. Vacuum coating machine energy accumulation of sputtering atom in the substrate is much taller than evaporation atomic energy conversion, high heat, some high-energy sputtering atom occur, different degree of written representation forms a layer of sputtering atom in the substrate and the substrate layer the amalgamation of the pseudo dispersed to each other, and, in the process of vacuum coating equipment film-forming substrate and activation has been in the plasma is clean, clear the sputtering atom adhesion is not strong, purification and activate the substrate surface, enhanced sputter atoms and substrate adhesion, thus higher sputtering Al film and substrate adhesion.