Electron Beam Evaporation Plating Technology

By electron beam eva​poration membrane after vaporization, condensation on the surface of the substrate is vacuum evaporation deposition techniques an important heating method. Many different types of such devices. With the extensive application of thin film technology, not only the requirements of film many species, but also on the quality of the film's more stringent requirements. Resistance evaporation deposition plating can not meet the needs of certain metallic and non-metallic. An electron beam source can be greater than the resistance of the heat source of the energy density, the value can be achieved (104- 109) W / CM2, so the membrane can be heated to 3000-6000 ℃. This is evaporated refractory metal and non-metallic materials such as tungsten, molybdenum, germanium, Si02, A1203 and so provide a better source. And because of the vapor deposition material is to be placed in the cold crucible, thus avoiding the reaction vessel and the evaporation material and the film material between the container material, which is to improve the purity of the film is very important. Additionally, heat can be directly applied to the membrane surface, thus high thermal efficiency, low thermal conductivity and heat radiation loss.

Electron beam (vacuum coating) is used as a heat source to melt membranes, its more categories, such as droplet, direct gun, ring and so on. Because these heat sources are a number of disadvantages for the vacuum evaporation apparatus, so in recent years has been replaced by magnetic deflection type electron beam source.